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FIGURE 60.1 Amount of copper wasted for various waste streams expressed as a percent of total copper discharge.

However, the key to minimizing the current consumption during the power-down sleep mode is not merely activating the power-down sleep mode in software, as I found out after some efforts. The AVR ports (PORTB and PORTD in our case) if configured in high-Z floating state or as inputs, consume quite some current (about 600 A for both the ports) even if the device is put in power-down sleep mode. To minimize this current consumption, I had to configure both the ports as outputs and I set the state of all the port bits to 1 , which resulted in a 1- A current consumption in power-down sleep mode, which is really amazing.

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1. Reduce the rinse water flow rate and volume. 2. Extend process bath life and reduce the dragout of a concentrated liquid (containing a contaminant such as copper). 3. Substitute materials where possible to eliminate or reduce the hazard of a particular waste. 60.4.1.2 Recycling and Recovery. The next step in the hierarchy of waste minimization options is recycling or recovery of any waste that cannot be reduced or eliminated at the source. It includes reuse of waste in the process or recovery of metals from a waste before disposal. Recycling and recovery can occur both on- or off-site. 60.4.1.3 Alternative Treatment. The last step in the waste minimization hierarchy is alternative treatment. Alternative treatments are selected to minimize the volume or hazard associated with a particular waste. The benefits for implementing a waste minimization program can include savings in equipment and operating cost, recovery of natural resources, and significant reduction in risk of the liabilities associated with the disposal of hazardous waste. One measure of the effectiveness of a waste minimization project is the project s effect on the organization s cash flow. These projects should pay for themselves through reduced waste management and raw material costs.

333 Merchant s Theory [8]

FIGURE 60.2 Major sources of copper expressed in grams per hour discharged. Inner- and outerlayer etching is excluded from this figure since it is so large in relation to the other contributors.

Some common techniques available for pollution prevention in a printed circuit board fabrication facility are listed as follows. While this list is not all-inclusive, it provides an overview of the types of things that are important to consider. A brief description of each option is presented in the next section. Rinse Water Reduction 1. Particulate filtration on deburr and panel-scrubbing operations with total or partial rinse water recycling 2. Etcher and conveyorized equipment design modifications 3. Immersion-type counterflow rinses 4. Alternating side spray rinses 5. Flexible orifice type flow restrictors 6. DI and soft water for rinsing Extend Bath Life 1. Filtration 2. Acid purification systems

3. 4. 5. 6.

In-tank electrolytic permanganate regeneration Proper rack design and maintenance Dragout recovery tanks Monitor solution activity

Ff = friction force FN = normal force Fc = cutting force Ft = thrust force Fs = shear force Fn = normal compressive force

Dragout Reduction 1. Etcher design 2. Automation 3. Rack design 4. DI and soft water for rinsing Material Substitution 1. Acid tin as an etch resist 2. Eliminate thiourea from tin/lead stripping baths 3. Permanganate desmear 4. Direct metallization to eliminate electroless deposition and the use of formaldehyde 5. Nonaqueous waste resists 6. Use of nonproprietary chemistry to avoid chelating agents

Rinse Water Reduction Most of the waste generated in the manufacture of printed circuit boards is from cleaning, plating, stripping, and etching This section describes some of the techniques available for reducing the volume of rinse water used 60511 Particulate Filtration on Deburr and Panel-Scrubbing Operations Deburrers are used to remove stubs of copper formed after the drilling of holes in double-sided and multilayer panels before they enter the copper deposition process where copper is deposited within the holes recently drilled in the panel Scrubbers are used to remove oxides from printed circuit laminates, clean the surface prior to a surface coating to provide better adhesion, and remove residuals after etching or stripping.

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